June 2003: MITSUBISHI presents the new DIP-IPMs
The low power IPM's are built in a dual-in-line package for inverter applications featuring direct coupling to the control circuit without the need for any opto-coupler or transformer isolation. They provide design engineers with a low cost and compact solution for small motor drives.
The Dual-In-Line Package Intelligent Power Modules (DIP-IPMs) are targeted for motor inverter drives (also for Hybrid Electric Vehicles (HEV) and Fuel Cell Electric Vehicle (FCEV) applications) or auxiliary machines. Traditional DIP- IPMs are mainly used for inverter drives in home appliances such as room air conditioners, washing machines and refrigerators.
The new super
high reliability DIP-IPM is also suitable for automobile applications, thus
contributing to the miniaturization of automobile inverter drive systems.
The increased use of energy-saving air conditioners in green automobiles
(HEV, FCEV) is in response to environmental concerns. To meet this need, smaller
and more reliable IPMs are required in the inverter drives for them
and other auxiliary motors. The application of DIP-IPMs in electric automobiles
is expected to contribute to the miniaturization of inverter drive systems
in other auxiliary motors as well.
There are
three main features for this application:
1. High Reliability with Reduced Mounting Surface Area Development of
high quality IPMs should improve product performance in harsh environmental
conditions. Failure probability has been greatly minimized through quality
control management. The temperature cycle capability has been improved
considerably by employing the new structure power chips (IGBT/2, FWD/3,
HVIC/4, LVIC/5). By using the new IPM, the mounting surface area of the device
and its interface circuit is reduced by about 40 percent, compared with
traditional IPMs with the same 30A/600V rating. This results in considerable
space savings.
2. Simplified Circuit Design by High Active Drive Logic The start up
sequence of the control supply is required as a countermeasure against
possible malfunctions during the control supply power on-and-off period in
a traditional IPM system. With the high active drive logic, this requirement
is no longer necessary. Furthermore, the new approach offers a versatile
interface compatible to 3V class MCU or DSP.
3. Reduction of malfunctioning by EMI/6 Noise Reduction By optimizing the
switching speed, EMI noise in the new DIP-IPM has been reduced by about 10db
in comparison with traditional products. Availability Product (PS21867-AJ)
samples will be available in March 2004 at 5,000 Japan yen per piece with
monthly mass production of 20,000 pieces scheduled to begin from January 2005.
Definitions
/1 Transfer-mold: Injecting heated and pressurized resin to a sealed container
(metallic mold) then applying pressure to form the shape. The productivity
is highly efficient since multiple shaping is possible in a single process.
/2 Insulated Gate Bipolar Transistor: Power device with features suitable
for high switching operations and voltage drives similar to MOS-FET, and low
on state voltage like that of a bipolar transistor.
/3 Free Wheeling Diode: Diode for carrying freewheeling current
/4 High Voltage Integrated Circuit: Integrated circuit with blocking voltage
over 50V for the drive and protection of switching semiconductor devices.
/5 Low Voltage Integrated Circuit: Integrated circuit with blocking voltage
under 50V for the drive and protection of switching semiconductor devices.
/6 Electromagnetic Interference: The electromagnetic waves generated by electronic
machines interfere with the proper operation of other electronic machines.
| Part Number | Applicable motor ratings |
| PS21562 |
0.2kW/AC220V |
| PS21563 |
0.4kW/AC220V |
| PS21564 |
0.75kW/AC220V |
| PS21864/-A |
0.75kW/AC220V |
| PS21865/-A |
1.5kW/AC220V |
| PS21867/-A |
2.2kW/AC220V |
| PS21869/-A |
3.7kW/AC220V |
